Silver Cadmium Oxide Contact Chips

Silver Cadmium Oxide (AgCdO) contact chips are manufactured through powder metallurgy and internal oxidation processes, combining refined silver with uniformly dispersed cadmium oxide particles. Engineered for medium-to-heavy load AC/DC switching applications, these contact components deliver arc erosion resistance, anti-welding properties under current surges, and stable contact resistance across cyclical operations.

AgCdO grades are tailored to distinct breaking capacity and switching requirements:

AgCdO 90/10 (10% CdO): Higher thermal and electrical conductivity with lower contact resistance; suitable for high-frequency switching operations.

AgCdO 88/12 (12% CdO): Balanced electrical conductivity and arc-quenching capability for general relays and contactors.

AgCdO 85/15 (15% CdO): Higher resistance to contact welding and electrical erosion under extreme short-circuit fault conditions.

Arc Energy Dissipation: Cadmium oxide sublimates under high arcing temperatures, absorbing arc energy without leaving conductive metallic residue.

Weld Resistance: Helps prevent contact fusion during initial high-current surges and motor locked-rotor conditions.

Conductivity Retention: Maintains stable contact resistance across repetitive load cycles under specified operating limits.

Controlled Erosion: Minimizes asymmetric material transfer under DC voltage configurations.

Flat Rectangular & Square: Thickness 0.4 mm to 3.5 mm; width/length 2.0 mm to 25.0 mm.

Domed & Radiused: Spherical radii R3.0 mm to R15.0 mm; center thickness tolerance within ±0.03 mm.

Profiled & Dished: Custom cross-sections featuring perimeter relief for controlled flux flow.

Single-Layer AgCdO: Designed for direct resistance welding onto contact support arms.

Bi-Metal (AgCdO / Fine Ag): 10% to 30% backing layer thickness to improve weldability and joint integrity.

Tri-Metal (AgCdO / Fine Ag / Cu): Multi-layer configuration optimized for high-speed automated assembly.

Pre-Applied Brazing Alloys: Integrated BAg-7 or BAg-24 backing layers (0.05 mm – 0.15 mm ±0.01 mm thickness).

Surface Finishes: Cross-hatched knurling, dimpled backing, or smooth cold-rolled options.

Industrial Contactors: Primary contact tips for AC-3 and AC-4 switching duties.

Molded Case Circuit Breakers (MCCB): Arcing and main contacts for 100 A to 630 A frame sizes.

Miniature Circuit Breakers (MCB): Short-circuit interrupting tips in protection devices.

Heavy-Duty Relays: Automotive starter relays and industrial power control modules.

Microstructure Verification: Optical microscopy verifies uniform CdO particle distribution and zero macro-porosity.

XRF Spectrometry: Verifies silver purity and backing layer thickness per batch.

Ultrasonic Flaw Detection: Scans bi-metal and tri-metal interfaces for bonding voids or delamination.

Mechanical Testing: Shear testing ensures structural integrity (≥180 MPa) under repetitive mechanical impacts.

Documentation: Certificate of Analysis (CoA) provided with every shipment detailing composition and density measurements.

Vacuum Sealed Packaging: Nitrogen-purged PE bags with desiccants (1,000 to 10,000 pieces per bag).

Tape & Reel: Anti-static carrier tape matching EIA-481 standards for pick-and-place automation.

Export Crates: Reinforced corrugated cartons on ISPM-15 compliant heat-treated pallets.

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