Description

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Silver Copper Oxide (AgCuO) Contact Strip is a heavy-duty functional composite clad material engineered for low-voltage switchgear and electrical contact assemblies. Manufactured through precision powder metallurgy, internal oxidation, and solid-state diffusion cladding, it offers balanced anti-welding characteristics, arc-erosion resistance, and stable contact resistance under surge current conditions. Supplied as continuous single-layer or multi-layer clad coils, this cadmium-free material is optimized for high-speed automated progressive die stamping of stationary and movable contact bridges.

Material Formulations & Selection Guide

AgCuO10 (Ag 90%, CuO 10%): Standard grade providing high thermal/electrical conductivity (70% - 78% IACS) and low initial contact resistance. Typically selected for general-purpose switching and lower inductive loads.

AgCuO12 (Ag 88%, CuO 12%): Mid-range oxide content offering enhanced arc-erosion resistance and reduced material transfer under moderate inductive loads.

AgCuO15 (Ag 85%, CuO 15%): High-oxide formulation engineered for severe arc-shorting and high peak inrush current applications (AC-3 / AC-4 motor switching).

Substrate Options: Oxygen-free copper (C11000) or brass (C26000) backing layers metallurgically bonded to the AgCuO functional layer to provide mechanical strength and optimize precious metal utilization.

Core Material Advantages

Anti-Welding & Arc Erosion Behavior: Finely dispersed copper oxide particles within the silver matrix modify arc mobility and stress distribution during high-current interruption, helping to mitigate contact welding and severe erosion during short-circuit events.

Low & Stable Contact Resistance: Engineered matrix structure helps maintain low millivolt drop across contact surfaces over repeated operations, contributing to controlled operating temperatures within designed switch housings.

Interfacial Bond Integrity: Solid-state cladding ensures continuous metallurgical bonding, designed to withstand automated high-speed stamping and thermal stress without delamination.

Environmental Compliance: Fully RoHS and REACH compliant cadmium-free alternative to traditional Silver Cadmium Oxide (AgCdO) contact materials.

Technical Data Sheet

Parameter	AgCuO Functional Layer	Clad Substrate / Composite Spec
Available Grades	AgCuO10 / AgCuO12 / AgCuO15	Pure Copper (C11000) / Brass (C26000)
Electrical Conductivity	AgCuO10: 70% - 78% IACS AgCuO12: 65% - 73% IACS AgCuO15: 60% - 68% IACS	≥ 98% IACS (Copper Substrate)
Hardness Range	80 - 140 HV	60 - 135 HV (M to T temper)
Material Density	≥ 9.80 g/cm³	~ 8.89 g/cm³ (Copper Base)
Strip Thickness	0.15 mm - 3.50 mm (Tolerance: ±0.005 mm)	Clad Layer Ratio: 10% - 50% of total thickness
Strip Width	3.0 mm - 120.0 mm (Tolerance: ±0.05 mm)	Precision slitting with deburred edges
Interfacial Bond Strength	N/A	Shear Stress > 180 MPa; No cracking/peeling at 180° bend

Dimensions & Cladding Configurations

Cladding Styles: Overlay, Inlay, Top-lay, Side-lay, and Multi-layer Full Clad (custom lay-ratio and strip profiles available upon engineering review).

Coil Delivery: Continuous pancake coils or plastic spools with zero unrecorded weld joints.

Core Inner Diameter (ID): Standard 100 mm, 200 mm, or 300 mm cores compatible with standard stamping decoilers.

Temper Conditions: Annealed (M), Half-Hard (Y2), Hard (Y), or Extra-Hard (T).

Target Applications

Molded Case Circuit Breakers (MCCB): Main, fixed, and arcing contacts (rated up to 630A).

AC / DC Contactors: Movable and stationary contact tips for industrial switching equipment.

Miniature Circuit Breakers (MCB) & Power Relays: High-volume stamped contact arms for distribution boards.

Industrial & Automotive Switches: Heavy-duty contacts subjected to inductive switching profiles.

Quality Assurance & Traceability

Metallographic Analysis: Microstructural inspection ensuring uniform CuO particle distribution without agglomeration or internal voiding.

Ultrasonic Flaw Detection: Continuous inline/batch non-destructive scanning to verify 100% interfacial bond coverage.

Composition & Layer Verification: X-ray Fluorescence (XRF) testing on every batch for precise precious metal thickness and alloy ratio control.

Mechanical & Electrical Testing: Eddy-current conductivity, Vickers hardness, and 180° bend testing performed per heat/lot batch.

Technical FAQ

Q: What makes AgCuO a preferred replacement for AgCdO?

A: AgCuO delivers comparable arc interruption and anti-welding performance in low-voltage applications without hazardous heavy metals, enabling full compliance with global RoHS and REACH standards.

Q: How is interfacial bond integrity verified between the AgCuO layer and the substrate?

A: Bond integrity is achieved through high-pressure diffusion cladding and validated via continuous ultrasonic inspection alongside mandatory 180° mechanical bend testing on lot samples.

Q: Can cladding profile, layer ratio, and coil dimensions be customized?

A: Yes. Total thickness, functional layer percentage (10%–50%), inlay/overlay positioning, width, and temper can be tailored to match your specific stamping tool designs and electrical performance requirements.

Q: What certification accompanies each shipment?

A: Every production batch is delivered with an EN 10204 3.1 Material Test Certificate, Certificate of Analysis (CoA), chemical analysis breakdown, and dimensional inspection reporting.

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